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Lexington’s 1366 Technologies, a developer of silicon wafer technology, raises $6 Million in a series B round of equity funding December 20, 2010

Posted by HubTechInsider in Startups, Venture Capital.
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Lexington’s 1366 Technologies, a developer of silicon wafer technology, raises $6 Million in a series B round of equity funding led by a group of investors including Hanwha Chemical, Ventizz Capital Fund, North Bridge Venture Partners and Polaris Venture Partners.

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